Reconfigurable NEMS based Advance Packaging for Anti Reverse Engineering and Counterfeiting

The chips used in modern electronic devices are mainly manufactured and packaged by Outsourced Semiconductor Assembly Test (OSAT) facilities potentially vulnerable to hardware attacks. Due the complexity of global supply chain, it is difficult track full fabrication process foundries or intellectual property (IP) owners. Additionally, design for fabricating packaging chip made IP owners remains same visible throughout process. Hence, this can be seen every entity chain using physical inspection techniques, making if any adversaries present chain. Security threats such as piracy, overbuilding, reverse engineering, counterfeiting thus possible potential These attacks have become an increasing concern world trusted microelectronics globalization continues develop. Several security methods already been developed protect detect until they embedded into sensitive systems, logic locking, obfuscating, physically unclonable functions (PUF), metering. However, these existing prevention their limitations not applicable all devices. In general, only a few make use inherent characteristics materials provide reliable security. novel assurance strategies with minimal changes modifications system circuit urgently required. This paper proposes technique obfuscation locking reconfigurable nano-electromechanical (NEMS) based advanced package Using technique, netlist/golden heterogeneously integrated will hidden from malicious adversaries, designer control its reaches end-user.